Intel (Dalian) Fab68 is seeking Ph.D candidates

发信人: staffing (staffing), 信区: Career

标 题: Intel (Dalian) Fab68 is seeking Ph.D candidates

发信站: BBS 水木清华站 (Wed Feb 13 14:43:17 2008), 站内



As the worlds largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art, from process development, yield improvements and test/sort to semiconductor manufacturing including final packaging. Employees in the Technology and Manufacturing Group are part of a worldwide workforce network of technology development and manufacturing including the assembly/test facilities. Qualified candidate will work in 300mm Fab68 located in Dalian, People’s Republic of China.





RESUME SUBMISSION

Resume Process: You may send your resume and cover letter to %26lt;mailto:staffing.china@intel.com%26gt;.

Pls use the title of "Apply for %26lt;Job Title%26gt;+%26lt;Name%26gt;+%26lt;Major%26gt;+%26lt;School%26gt;".



Resume submission deadline: Mar 15th, 2008. We will start telephone and face to face interview in the middle of Mar, 2008.



Travel Requirement:

All the below positions may require 3 to 6 months training assignment in an Intel ATM site (Shanghai) and possibly another 6 to 9 month training assignment in US.



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Job Title: HPM Process Engineer



Responsibilities

Prior to fab start up, the HPM Engineers will primarily focus on learning the Intel corporate culture/policies/procedures skills either in China or in USA. They will also focus on the learning of equipment maintenance and trouble shooting skill as well as process and operational knowledge. The additional primary roles in this time frame will be as following: 1) Assist module team leader to define strategy and plan for the various engineering functional areas (Litho, Etch, TFP and DEI) with respect to safety, quality, process and equipment, automation and factory readiness; 2) Help module team leaders to hire new employees and be a primary owner of training those new hires. During fab start up, they will be part of start up team and grow to technical experts in equipment aspects through to training new employees and participating in the fab start up. They will be required to work with the team to perform extensive hands-on work and carry out troubleshooting of equipment issues. Through the hardworking, they will develop expertise in trouble shooting of sophisticated and advanced semiconductor manufacturing equipments. They should be effective in providing timely solutions to equipment issues and be able to support 7x24 Fab operations on the shift base. They will be also required to apply LEAN rules and principles to daily activities such as Operation Excellence and HPM programs to improve the performance of semiconductor process and equipment.



Qualifications

The preferred candidates should have a Ph.D degree in EE, MechE, ChE and Materials Science or in the related fields, with good communication skills in both English and Chinese. Direct semiconductor manufacturing experience of equipments in the areas of Litho, Etch, TFP and DEI will a good plus. They should also have very good attitudes of dedication to daily fab operation such as equipment maintenance and trouble shooting as well as equipment improvement, and they should be willing to mentor junior engineers. They are able to demonstrate the technical skills of equipments in the related process modules. They are able to provide problem solving cases associated with equipment issues through logical thinking and problem solving techniques.

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Job Title: AFM Engineer



Responsibilities

Intel Dalian 300 mm wafer factory (F68) Labs are seeking applicants for Atomic Force Microscopy (AFM) Engineer. The successful candidate will be responsible for working with a team of engineers and technicians to perform surface topography analysis for Intel 65 nm logic technology using advanced AFM instrument. The candidate may be required to take a 3-6 months training/seed assignment at Intel existing wafer manufacturing facilities in US or Ireland to learn new equipment/processes.



Qualifications

The candidates should have a Ph.D degree major in Material Science, Physics or related disciplines. Previous experience with AFM, SCM or similar is a highly desirable qualification. The ability to demonstrate in-depth understanding of analytical equipment and semiconductor process flow operation is required. The knowledge of basic statistics is highly preferred. The candidate must be a good team player and be able to establish collaborative relationships with Intel virtual factory labs partners and internal customers.

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Job Title: Analytical Chemistry Engineer



Responsibilities

Intel Dalian 300 mm wafer factory (F68) Labs are seeking applicants for Analytical Chemistry Engineer. The successful candidate will be responsible for working with a team of engineers and technicians to perform wet chemical analysis for Intel 65 nm logic technology using a variety of materials and chemical analysis equipment. The candidate may be required to take a 3-6 months training/seed assignment at Intel existing wafer manufacturing facilities in US or Ireland to learn new equipment/processes.



Qualifications

The candidates should have a Ph.D degree major in Analytical Chemistry, Material Science or related disciplines. Previous experience with ICPMS, TXRF or similar is a highly desirable qualification. The ability to demonstrate in-depth understanding of analytical equipment and semiconductor process flow operation is required. The knowledge of basic statistics is preferred. The candidate must be a good team player and be able to establish collaborative relationships with Intel virtual factory labs partners and internal customers.

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Job Title: Module Team Leader



Responsibilities

Prior to fab start up, the module team leaders will primarily focus on learning the Intel corporate culture/policies/procedures and leadership skills either in China or in USA. They will also focus on the learning of process technology and equipment knowledge, and operational knowledge. The additional primary roles in this time frame will be as following: 1) Define strategy and plan for the various engineering functional areas (Litho, Etch, TFP and DEI) with respect to safety, quality, equipment and process, automation and factory readiness; 2) Recruit/hire new engineers and then train/mentor those new hires in future. During fab start up, they will be part of leader team and grow to technical experts/leadership through leading and training their team to start up fab as well as participating in the fab start up. They will be required to lead and work with their team to perform extensive hands-on work and carry out troubleshooting. Through the hardworking and commitment, they will develop leadership skills and expertise in trouble shooting of sophisticated and advanced semiconductor manufacturing process and tools. They should be effective in providing timely solutions to process and equipment issues and be able to support 7x24 Fab operations. They will be also required to apply LEAN rules and principles to daily activities such as Operation Excellence and HPM programs to improve the performance of semiconductor process and equipment.



Qualifications

The preferred candidates should have a Ph.D degree in EE, MechE, ChE and Materials Science or in the related fields, with good communication skills in both English and Chinese. Direct semiconductor manufacturing experience in the areas of Litho, Etch, TFP and DEI, with preference to those candidates with relevant management experience will be a big plus. They should also have very good attitudes of dedication to the daily fab operation such as process sustaining, equipment maintenance/trouble shooting and their improvement, and they should be willing to lead a team. They are able to demonstrate the leadership and technical skills in the related process modules. They are able to provide problem solving cases associated with silicon through the logical thinking and problem solving techniques.

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Job Title: Process Engineer



Responsibilities

Prior to fab start up, the process engineers will primarily focus on learning the Intel corporate culture/policies/procedures skills either in China or in USA. They will also focus on the learning of process technology and equipment skill as well as operational knowledge. The additional primary roles in this time frame will be as following: 1) Assist module team leader to define strategy and plan for the various engineering functional areas (Litho, Etch, TFP and DEI) with respect to safety, quality, equipment and process, automation and factory readiness; 2) Help module team leaders to hire new employees and be a primary owner of training those new hires. During fab start up, they will be part of start up team and grow to technical experts through to training new employees to start up fab and participating in the fab start up. They will be required to work with the team to perform extensive hands-on work and carry out troubleshooting. Through the hardworking and commitment, they will develop expertise in trouble shooting of sophisticated and advanced semiconductor manufacturing process and tools. They should be effective in providing timely solutions to fab process issue and be able to support 7x24 Fab operations. They will be also required to apply LEAN rules and principles to daily activities such as Operation Excellence and HPM programs to improve the performance of semiconductor process and equipment.



Qualifications

The preferred candidates should have a Ph.D degree in EE, MechE, ChE and Materials Science or in the related fields, with good communication skills in both English and Chinese. Direct semiconductor manufacturing experience of semiconductor process in the areas of Litho, Etch, TFP and DEI will be a big plus. They should also have very good attitudes of dedication to daily fab operation such as process sustaining and its improvement, and they should be willing to mentor junior engineers. They are able to demonstrate the technical skills of semiconductor process in the related process modules. They are able to provide problem solving cases associated with silicon process through the logical thinking and problem solving techniques.

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Job Title: SEM Engineer



Responsibilities

Intel Dalian 300 mm wafer factory (F68) Labs are seeking applicants for Scanning Electron Microscopy (SEM) Engineer. The successful candidate will be responsible for working with a team of engineers and technicians to perform imaging and composition analysis for Intel 65 nm logic technology using a variety of advanced SEM instrument. The candidate may be required to take a 3-6 months training/seed assignment at Intel existing wafer manufacturing facilities in US or Ireland to learn new equipment/processes.



Qualifications

The candidates should have a Ph.D degree major in Material Science, Physics or related disciplines. Previous experience with SEM, STEM, EDS or similar is a highly desirable qualification. The ability to demonstrate in-depth understanding of analytical equipment and semiconductor process flow operation is required. The knowledge of a variety of SEM specimen preparation methods is highly preferred. The candidate must be a good team player and be able to establish collaborative relationships with Intel virtual factory labs partners and internal customers.

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Job Title: SIMS Engineer



Responsibilities

Intel Dalian 300 mm wafer factory (F68) Labs are seeking applicants for Secondary Ion Mass Spectrometry (SIMS) Engineer. The successful candidate will be responsible for working with a team of engineers and technicians to perform trace level composition analysis for Intel 65 nm logic technology using a state-of-the-art SIMS instrument. The candidate may be required to take a 3-6 months training/seed assignment at Intel existing wafer manufacturing facilities in US or Ireland to learn new equipment/processes.



Qualifications

The candidates should have a Ph.D degree major in Material Science, Analytical Chemistry or related disciplines. Previous experience with SIMS, Tof SIMS or similar is a highly desirable qualification. The ability to demonstrate in-depth understanding of analytical equipment and semiconductor process flow operation is required. The knowledge of basic statistics is preferred. The candidate must be a good team player and be able to establish collaborative relationships with Intel virtual factory labs partners and internal customers.

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Job Title: TEM Engineer



Responsibilities

Intel Dalian 300 mm wafer factory (F68) Labs are seeking applicants for Transmission Electron Microscopy (TEM) Engineer. The successful candidate will be responsible for working with a team of engineers and technicians to perform microstructural and microchemical analysis for Intel 65 nm logic technology using a state-of-the-art TEM instrument. The candidate may be required to take a 3-6 months training/seed assignment at Intel existing wafer manufacturing facilities in US or Ireland to learn new equipment/processes.



Qualifications

The candidates should have a Ph.D degree major in Material Science, Physics or related disciplines. Previous experience with TEM, STEM, EDS, EELS, spectrum imaging or similar is a highly desirable qualification. The ability to demonstrate in-depth understanding of analytical equipment and semiconductor process flow operation is required. The knowledge of a variety of TEM specimen preparation methods is highly preferred. The candidate must be a good team player and be able to establish collaborative relationships with Intel virtual factory labs partners and internal customers.

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Job Title: Statistician



Responsibilities

Fab 68 Integration is looking for highly motivated individuals with strong technical background and capabilities to join a 300mm logic chipset factory in Dalian, China. In this position as Fab 68 Statistician, your responsibilities include:

- Statistical support for F68 engineering teams, and helping establish F68 quality control systems;

- Developing statistical data collection and analysis methodologies for F68 ramp and new production introductions;

- Exercising good judgment, sometimes with insufficient data, to determine appropriate action and mitigate integrated risks;

- Cost effective design of experiments to help F68 engineering troubleshoot technical issues;

- Extensive training and program development to advance statistical literacy in F68 engineering organizations;

- Real time response to customer requests or events as they occur, and developing timely recommendations.



Qualifications:

Must possess Ph.D degree in Engineering, and must have formal graduate level training in statistics as well as several years of direct experiences applying statistical concepts to relevant problems. Degrees in Statistical Mathematics or related fields are desirable, but not required.

Additional qualifications include:

1) Must have a proven track record demonstrating critical thinking and creative problem solving skills.

2) Demonstrated ability in analyzing complex data and reaching sound conclusions.

3) Ability to multi-task and be effective in providing timely solutions, with an innate grasp of the 7x24 nature in Fab operations

4) Strong communication skills to manage tasks across Process Engineering areas to effectively execute and commit to deliverables

5) Flexibility and maturity in facing uncertainties associated with changing priorities and responsibilities to support business needs are expected

6) Conversational English skills and good written skills in English

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Job Title: Process Integration Engineer



Responsibilities

Fab 68 Integration is looking for highly motivated individuals with strong technical background and capabilities to join a 300mm logic chipset factory in Dalian, China. In this position as Integration Engineer, your responsibilities will include but not be limited to:

- Participating in technology start-up and ramp activities to meet yield, reliability, cost, and device performance goals;

- Driving and prioritizing integrated experiments to troubleshoot and optimize process flows;

- Owning particular sections of process flow, and responsible for its optimization, cost reduction, and performance improvement goals;

- Maintaining and driving process qualification matrix and deliverables;

- Rapid response to process excursions and drive to quick integrated solutions;

- Working with Process Engineering to improve process stability and capability as well as reduce defects;

- Exercising good judgment, sometimes with insufficient data, to determine appropriate action and mitigate integrated risks;

- Sustaining and improving integrated process flow to meet cost and performance goals



Qualifications:

Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or other related engineering disciplines

Additional qualifications include:

1) Must have a proven track record demonstrating critical thinking and creative problem solving skills.

2) Demonstrated ability in analyzing complex data and reaching sound conclusions.

3) Ability to multi-task and be effective in providing timely solutions, with an innate grasp of the 7x24 nature in Fab operations

4) Strong communication skills to manage tasks across Process Engineering areas to effectively execute and commit to deliverables

5) Flexibility and maturity in facing uncertainties associated with changing priorities and responsibilities to support business needs are expected

6) Conversational English skills and good written skills in English

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Job Title: Yield Analysis Engineer



Responsibilities

Fab 68 Yield Analysis group is looking for highly motivated individuals with strong technical background and capabilities to join a 300mm logic chipset factory in Dalian, China. In this position as Yield Analysis Engineer, your responsibilities include:

- Working with Integration and Process Engineering to improve process stability and capability as well as reduce defects;

- Monitoring Fab 68 yield performance and helping prioritize yield projects within the factory

- Monitoring Intel factory network yield comparison and driving yield matching and commonality analysis

- Supporting excursion task force monitoring critical yield issues and baseline improvement

- Performing yield prediction, and recommending yield improvement roadmaps and priorities to Process Engineering and Integration

- Owning deployment of yield analysis tools and methodology, and proliferation of analytical skills within the factory

- Owning the data automation capability and improvement for the factory yield systems



Qualifications:

Candidates must possess a Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or related engineering disciplines.

Additional qualifications include:

1) Must have a proven track record demonstrating critical thinking and creative problem solving skills.

2) Demonstrated ability in analyzing complex data and reaching sound conclusions.

3) Ability to multi-task and be effective in providing timely solutions, with an innate grasp of the 7x24 nature in Fab operations

4) Strong communication skills to manage tasks across Process Engineering areas to effectively execute and commit to deliverables

5) Flexibility and maturity in facing uncertainties associated with changing priorities and responsibilities to support business needs are expected

6) Conversational English skills and good written skills in English

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Job Title: Device Integration Engineer



Responsibilities

Fab 68 Integration is looking for highly motivated individuals with strong technical background and capabilities to join a 300mm logic chipset factory in Dalian, China. In this position as Device Integration Engineer, your responsibilities are:

- Participating in technology start-up and ramp activities to meet yield, reliability, cost, and device performance goals;

- Maintaining and driving device performance matching matrix and deliverables

- Exercising good judgment, sometimes with insufficient data, to determine appropriate action and mitigate integrated risks

- Analyzing electrical parametric and characterization data from process experiments

- Characterizing device structures to validate layout design rules and circuit performance goals

- Interfacing with process integration, Q%26amp;R, and Product Engineering to improve cost and performance for the chipset technology



Qualifications:

Candidates must have a Ph.D degree in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or equivalent engineering disciplines

Additional qualifications include:

1) Must have direct experiences in device and/or semiconductor physics and electrical characterization in graduate field of study

2) Demonstrated ability in analyzing complex data and reaching sound conclusions.

3) Ability to multi-task and be effective in providing timely solutions, with an innate grasp of the 7x24 nature in Fab operations

4) Strong communication skills to manage tasks across Process Engineering areas to effectively execute and commit to deliverables

5) Flexibility and maturity in facing uncertainties associated with changing priorities and responsibilities to support business needs are expected

6) Conversational English skills and good written skills in English

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Job Title: Defect Reduction Engineer



Responsibilities

This position is for Defect Reduction engineer in Intel Dalian 300mm Fab 68. Successful candidate will be participating and driving activities pertaining to defect metrology (tools, processes, and systems) and defect reduction activities contributing to yield sustaining and enhancements.

Your responsibilities will include but not be limited to:

- Participating in technology start-up %26amp; ramp activities to meet yield, reliability, cost, device performance goals;

- Driving and prioritizing integrated experiments to troubleshoot and reduce defects

- Owning one or more integrated defect monitors and driving them to best in class performance

- Rapid response to process excursions and help drive to quick integrated solutions;

- Working with Process Engineering and Integration to improve process stability and capability as well as reduce defects;



Qualifications:

Candidates must possess a Ph.D degree in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or related engineering disciplines.

Additional qualifications include:

1) Must have a proven track record of critical thinking and problem solving.

2) Demonstrated ability in analyzing complex data and reaching sound conclusions.

3) Ability to multi-task and be effective in providing timely solutions, with an innate grasp of the 7x24 nature in Fab operations

4) Strong communication skills to manage tasks across Process Engineering areas to effectively execute and commit to deliverables

5) Flexibility and maturity in facing uncertainties associated with changing priorities and responsibilities to support business needs are expected

6) Conversational English skills and good written skills in English

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Job Title: Q%26amp;R Engineer



Responsibilities

This position is for Quality and Reliability engineer for Intel Dalian Fab 68. This position reports to the Q%26amp;R manager in the Yield Department.

Your responsibilities will include but not be limited to:

- Supporting the resolution of excursion material and their disposition

- Coordinating assembly engineering capacity and failure analysis requests;

- Ongoing monitoring of process health and reliability

- Deployment and maintenance of quality and Rel data systems;

- Representation of Fab68 Q%26amp;R at various Intel factories, joint fab/assy/test and corporate forums;

- Reliability monitor data analysis (including accelerated Reliability testing models)

- Failure rate modeling for defect mechanisms.



Qualifications

Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or equivalent engineering disciplines

Additional qualifications include:

1) Must have a proven track record demonstrating critical thinking and creative problem solving skills

2) Demonstrated ability in analyzing complex data and reaching sound conclusions.

3) Ability to multi-task and be effective in providing timely solutions, with an innate grasp of the 7x24 nature in Fab operations.

4) Strong communication skills to manage tasks across Process Engineering areas to effectively execute and commit to deliverables

5) Flexibility and maturity in facing uncertainties associated with changing priorities and responsibilities to support business needs are expected

6) Conversational English skills and good written skills in English

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